• ms.lane@lemmy.world
      link
      fedilink
      English
      arrow-up
      2
      ·
      13 days ago

      ~140mm2 die on SMIC N+3 which has terrible yields (understandable, 5nm on DUV is a fools errand, but China has no choice since ASML won’t supply them EUV)

    • geneva_convenience@lemmy.ml
      link
      fedilink
      arrow-up
      2
      arrow-down
      1
      ·
      13 days ago

      Lamming a lot of electronics in a very small device is actually more complicated than a large device.

      Also, laptops don’t have like twenty cameras.